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Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment
Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment
Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment
Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment
Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment
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Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment
Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment
Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment
Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment
Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment

Vacuum Plasma Cleaner System Environmentally Friendly and Efficient Surface Plasma Cleaning Equipment

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Product Description

📋 Basic Information
Model NO. GA-2206-B
Usage Vacuum Plasma Cleaner
Transport Package Plywood Case
Origin China
HS Code 9024800000
Capacity 200 Units
📍 Product Description

Vacuum Plasma Cleaning System: An environmentally friendly and efficient surface treatment solution. Through the excitation power supply, gas is separated into a plasma state. This plasma interacts with product surfaces to remove pollutants, improve surface activity, and significantly enhance adhesion.

Key Product Features:
✔ Flexible fixture design adapted to irregular products.
✔ Horizontal electrode design for soft product processing.
✔ Low energy and gas consumption.
✔ Convenient board loading and unloading.
✔ Integrated vacuum system with small footprint.
✔ Optimized reaction space for uniform treatment.
✔ PLC-based integrated control system for easy operation.
Industry Applications:
⚙ Mobile Industry: Cleaning and activation of TP, middle frames, and back covers.
⚙ PCB/FPC Industry: Hole drilling cleaning and Coverlay surface roughening.
⚙ Semiconductor: Packaging for camera modules, LEDs, BGA, and wire bond pretreatment.
⚙ Ceramics: Packaging and glue pre-treatment.
⚙ Etching: PI surface roughening, PPS etching, and ITO film etching.
📝 Product Parameters
Parameter Category Specifications (Option A) Specifications (Option B)
Power System Power Type Radio-frequency (RF) Medium-frequency (MF)
Range / Freq 0~600W / 13.56MHz 0~2000W / 40KHz
Vacuum System Pump Type Double stage rotary vane pump / Roots pump
Chamber Material Aluminum alloy (Customizable Stainless Steel)
Chamber Size 500 × 500 × 670 mm (W x H x D)
Effective Electrode 587 × 470 mm
Control & Gas Gas Path Dual channel (Standard), 0~300SCCM
Control Method PLC + 7 Inch Touch Screen
Dimensions Outer Size 1020 × 1720 × 1120 mm
Weight Total Weight 350 KG
📷 Detailed Photos
Vacuum Plasma Cleaner Front View
Plasma Cleaning System Detail
❓ Frequently Asked Questions
Q: What is the primary function of a Vacuum Plasma Cleaner? A: It is used to remove surface contaminants at a microscopic level and increase surface energy to improve the bonding strength of adhesives, coatings, or inks.
Q: What power frequencies are available for this equipment? A: We offer two standard configurations: 13.56MHz Radio-frequency (RF) and 40KHz Medium-frequency (MF) power supplies to suit different processing needs.
Q: Is the plasma cleaning process environmentally friendly? A: Yes, it is a dry cleaning process that eliminates the need for hazardous chemical solvents, making it a sustainable choice for industrial surface treatment.
Q: Can the vacuum chamber be customized? A: While the standard chamber is made of aluminum alloy, we can provide customizable stainless steel cavities based on specific material requirements.
Q: Which industries commonly use this system? A: It is widely used in the mobile phone, PCB/FPC manufacturing, semiconductor packaging, LED, and automotive electronics industries.
Q: What gas is typically used in the system? A: The system supports standard process gases, and flow rates can be precisely controlled between 0~300SCCM via the integrated PLC system.

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